Eclecticos
04-28-2008, 05:36 AM
OCZ Flex II Water-Cooling Technology enables high frequency memory to operate within the optimal range at extreme speeds and low latencies without the high temperatures that could damage the module.
Each PC3-16000 Flex II memory module features thermal management technology from OCZ that includes a new heatspreader with an integrated liquid injection system and dedicated channels that pass directly over the module's ICs to effectively disperse heat produced by high speed memory.
This highly sophisticated series was uniquely engineered with a flexible design to give users the option to run the modules passively or utilize the water cooling. The use of both options promotes maximum heat dissipation.
http://img87.imageshack.us/img87/6811/flex2diagrambb1.jpg
Each PC3-16000 Flex II memory module features thermal management technology from OCZ that includes a new heatspreader with an integrated liquid injection system and dedicated channels that pass directly over the module's ICs to effectively disperse heat produced by high speed memory.
This highly sophisticated series was uniquely engineered with a flexible design to give users the option to run the modules passively or utilize the water cooling. The use of both options promotes maximum heat dissipation.
http://img87.imageshack.us/img87/6811/flex2diagrambb1.jpg