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View Full Version : ExtreMat Cooling Technology!



Eclecticos
04-09-2009, 12:01 PM
http://img17.imageshack.us/img17/2779/extremat.jpg

Research News (http://www.fraunhofer.de/EN/press/pi/2009/04/ResearchNews042009Topic3.jsp)

Researchers at one of Germany’s Fraunhofer Institute think they have come up with a better material to dissipate heat in electronics, using a material that combines traditional materials like copper with diamond power.

A novel material is needed because of the new challenges arising as more and more previously separated electronic units are being combined on single chips. More components mean more heat in a shrinking volume, yet components and connecting elements need to be kept in the safe zone – 90°C to 130°C.

Currently, copper or aluminum plates are attached to the chip’s components to act as heat sinks. But, the expansion and contraction of the metal plate (which can expand about three or four times as much as the silicon and other ceramic material in the rest of the chip) often leads to cracks and breaks at solder points.

Via: CeramicTechWeekly.Org (http://ceramictechweekly.org/?tag=extremat)

SXRguyinMA
04-09-2009, 12:15 PM
neato

TheGreatSatan
04-09-2009, 01:07 PM
Geez, first the Shamwow, now this. Germans are amazing!

progbuddy
04-13-2009, 10:04 PM
Geez, first the Shamwow, now this. Germans are amazing!

I love you.

Luke122
04-14-2009, 12:46 PM
Geez, first the Shamwow, now this. Germans are amazing!

LOL!

I bet this doesnt beat up hookers though!

Eclecticos
04-14-2009, 02:19 PM
This material is created by adding diamond powder to copper.
Diamond conducts heat roughly five times better than copper.