Using Thermal Compounds

From TheBestCaseScenario

Thermal compounds are used to promote heat dissipation by filling the minute grooves and cracks in between the chip and the heatsink/heatspreader. To place new thermal compounds on a chip:

1. Remove heatsink/heatspreader (warning: this may void warranties in some cases) making sure the power is in the OFF position.

2. Remove old thermal paste with a dry tissue (some may be left).

3. Using a Q-Tip, gently place Isopropyl Alchohol on the contact, making sure it dries thoroughly. Wipe surface clean.

4. Place a small dab of thermal compound towards the center of the surface, and use a credit card or other flat object to smooth the thermal paste across the surface.

6. Mount heatsink to surface, making sure all connections are tight.

7. Plug in fan cable (if needed).

You may need to "break in" the thermal compound. During this time temperatures may be slightly higher than normal, but then will proceed to lower temperatures. This may occur for the first few days.

Generally, new thermal paste lowers temperatures by 3-5 degrees Celsius.