Originally Posted by
Kaej
Would it be possible to cool the air that flows into and over the components and HSFs in a case? If watercooling uses air to take heat away from water, is there a way to take heat away from air in a similar way?
This at first SOUNDS like a stupid idea but think about it. Water cooling can only account for certain components in the case. At the very most it will cater for the CPU, GPU, GPU memory, HDDs and RAM and chipset, maybe with a few mosfets. But that still leaves voltage converters, the whole of the motherboard and every other component in the case.
By cooling the air going in you can effectively cool every corner, nook, cranny and component inside the PC. Effective exhausting would be essential (now thats alliteration kids!) but this would be air-con for the case.
Any thoughts?